Baverstam Associates Logo Baverstam Associates
 

Baverstam Newsletter Summary: Volume 4, Issue 3


Materials in Semiconductor and Photonic Packaging

Advanced materials are used in semiconductors and photonics in a number of areas, but perhaps most importantly in packaging. Rapid progress is being made in this area. Baverstam provides a brief overview of the current technology relating to semiconductor and photonic packaging and thermal management issues in this newsletter. It also highlights recent articles, developments and product announcements relating to advanced materials in packaging and thermal management.




  Purchase the full feature issue of this newsletter or other back issues of Baverstam Newsletters as a non-member ($750 each):
Members - Log on to your Baverstam account to access the newsletters:
Register now! and receive our free sample newsletters by email.

 

Copyright Baverstam Associates. All Rights Reserved. Login

Home | Consulting | Membership | Clients & Partners | Publications | Our Staff | Contact Us